| 摘要 |
<p>A system and method is disclosed for coating a conventional wafer or a spherical shaped semiconductor substrate (10) with liquid material (31) such as a photoresist by utilizing a 'drop on demand' piezoelectric driven dispense nozzle, a bubble-jet dispense nozzle, or a continuous piezo jet with charging electrodes (32). The proposed system and method will greatly reduce, and in some cases virtually eliminate, the waste of photoresist in the process.</p> |
