Sol material for porous dielectric film formation comprises specified amount of silicon alkoxide, alcohol, aqueous medium, base and additives

摘要

Sol material comprises 2-60 weight parts (wt.pts) of silicon alkoxide, 20-98 wt.pts of alcohol, 0.5-50 wt.pts of aqueous medium, 0.0001-10 wt.pts of base and 0.001-30 wt.pts of additive. The sol is obtained by hydrolysis and condensing the raw material with adhesive. Sol material comprises 2-60 weight parts (wt.pts) of silicon alkoxide, 20-98 wt.pts of alcohol, 0.5-50 wt.pts of aqueous medium, 0.0001-10 wt.pts of base and 0.001-30 wt.pts of additive. The sol is obtained by hydrolysis and condensing the raw material with adhesive chosen from the formulae R<1>nSi(OCH3)4-n (I), R<1>nSi(OC2H5)4-n (II), R<1>COOH (III), R(OH)m (IV) or R<1>nSi(Cl)4-n (V): R' = H, 1-20C alkyl, alkenyl, phenyl, optionally substituted amino groups or ester groups; R = 1-20C alkyl, alkenyl, phenyl, optionally substituted amino groups or ester groups; n = 0-3; and m = 1-3.