| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting density of a circuit board and an integrated circuit device. SOLUTION: An electric double layer capacitor is formed on the cover member 4 of a circuit board 1 provided with an insulating board 2, where the electronic parts of a semiconductor element 3 and the like are loaded on a surface and the cover member 4 fixed to the insulating board 2, so that a part of or all electronic components of the semiconductor element 3 and the like, which are loaded on the surface of the insulating board 2, are concealed. The mounting area of the electronic parts of the board and a device is increased, mounting density can be improved and the circuit board, and the integrated circuit device can be miniaturized by providing the electric double layer capacitor in a cover body and a case substrate. |
