| 摘要 |
<p>The present invention relates to use of an inhibitor compound in an organosilicon composition for inhibiting curing of the organosilicon composition by a hydrosilylation reaction at a temperature of 40 °C to 100 °C, or 100 °C and above, and a pressure of 1 x 106 n/m2 to 5 x 106 N/m2, or 5 x 106 N/m2 and above. In a preferred application the organosilicon composition cures to form a silicone gel or elastomeric seal or plug within an oil or gas well. Preferred inhibitor compounds are 1-ethynyl-1-cyclopentanol and 1-ethynyl-1-cyclohexanol.</p> |
