| 摘要 |
The method provides solder contacts (35) on contacts (20) provided on the outside of an electrical or electronic component (25) by depositing solder on a carrier plate, in correspondence to the position of the component contacts and heating the solder after depositing the component on the carrier plate, so that the solder is transferred to the component contacts. The solder is deposited on a glass or ceramic carrier plate as a solder paste via a screen printing process using a screen printing mask. |
