Low voltage MOS device and corresponding manufacturing process

摘要

A low-voltage MOS device (100) having high ruggedness, low on-resistance, and body diode reverse recovery characteristics comprises a semiconductor substrate (101) on which is disposed a doped upper layer (102) of a first conduction type. The upper layer includes at its upper surface a blanket implant of the first conduction type, a heavily doped source region (113) of the first conduction type, and a heavily doped body region (112) of a second and opposite conduction type. The upper layer further includes a doped first well region (108) of the first conduction type and a doped well region (109) of the second conduction type underlying the source and body regions. The first well region (108) underlies the second well region (109) and merges with the blanket implant to form a heavily doped neck region that abuts the second well region at the upper surface of the upper layer. A gate comprising a conductive material separated from the upper layer by an insulating layer is disposed on the upper layer overlying the heavily doped neck region.