发明名称 Method and apparatus for cleaning a semiconductor device
摘要 <p>An apparatus (100) for manufacturing a semiconductor device by toning a thin film (Wb, We) on a substrate (W), comprises a cleaning process section for cleaning the substrate (W) using a cleaning solution and a drying process section for jetting compressed gas onto the cleaned substrate (W), thereby removing the cleaning solution on the substrate (W), wherein the cleaning process section includes a nozzle body (111a to 111c) for jetting the cleaning solution onto the substrate (W) under high pressure. <IMAGE></p>
申请公布号 EP1058290(A1) 申请公布日期 2000.12.06
申请号 EP20000105305 申请日期 2000.03.15
申请人 KANEKA CORPORATION 发明人 HAYASHI, TAKAYUKI;OKATSU, TOSHIHIDE
分类号 H01L21/00;H01L21/306;(IPC1-7):H01L21/00 主分类号 H01L21/00
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