发明名称 |
Method and apparatus for cleaning a semiconductor device |
摘要 |
<p>An apparatus (100) for manufacturing a semiconductor device by toning a thin film (Wb, We) on a substrate (W), comprises a cleaning process section for cleaning the substrate (W) using a cleaning solution and a drying process section for jetting compressed gas onto the cleaned substrate (W), thereby removing the cleaning solution on the substrate (W), wherein the cleaning process section includes a nozzle body (111a to 111c) for jetting the cleaning solution onto the substrate (W) under high pressure. <IMAGE></p> |
申请公布号 |
EP1058290(A1) |
申请公布日期 |
2000.12.06 |
申请号 |
EP20000105305 |
申请日期 |
2000.03.15 |
申请人 |
KANEKA CORPORATION |
发明人 |
HAYASHI, TAKAYUKI;OKATSU, TOSHIHIDE |
分类号 |
H01L21/00;H01L21/306;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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