发明名称 Curable resin composition
摘要 This invention has its object to provide a curable resin compositions useful as contact adhesives with a prolonged tack retention period, without affecting the final bond strength. This invention is related to a A curable resin composition which comprises (I) a reactive silicon group-containing polyether oligomer, (II) a copolymer comprising a molecular chain substantially composed of one or more acrylate ester monomer units and/or methacrylate ester monomer units and (III) an accelerator.
申请公布号 EP1057866(A2) 申请公布日期 2000.12.06
申请号 EP20000111019 申请日期 2000.05.30
申请人 KANEKA CORPORATION 发明人 KOTANI, JUN;KUSAKABE, MASATO;IWAKIRI, HIROSHI
分类号 C08L71/02;C08L33/06;C08L43/04;C09J143/04;C09J171/02;(IPC1-7):C08L33/06 主分类号 C08L71/02
代理机构 代理人
主权项
地址