发明名称 |
Wafer edge cleaning method and apparatus |
摘要 |
A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid. <IMAGE>
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申请公布号 |
EP1058300(A2) |
申请公布日期 |
2000.12.06 |
申请号 |
EP20000302704 |
申请日期 |
2000.03.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
REDEKER, FRED C.;BROWN, BRIAN J.;SUGARMAN, MICHAEL |
分类号 |
B08B1/00;B08B3/02;B08B3/04;B08B3/08;B08B3/12;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):H01L21/306;B08B11/00 |
主分类号 |
B08B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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