发明名称 Radiation sensitive resin composition and use of the same in an interlaminar insulating film
摘要 <p>A radiation sensitive resin composition which can be processed and molded at low temperatures and has resolution, solvent resistance, adhesion to a substrate and storage stability required as an interlaminar insulating film. This radiation sensitive resin composition comprises: (A) a copolymer obtained by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy compound such as beta -methylglycidyl acrylate and/or an epoxy compound such as a monomer represented by the following formula (3): &lt;CHEM&gt; and (a3) an olefinic unsaturated compound other than the above (a1) and (a2); and (B) a 1,2-quinonediazide compound.ti</p>
申请公布号 EP1057859(A2) 申请公布日期 2000.12.06
申请号 EP20000111681 申请日期 2000.05.31
申请人 JSR CORPORATION 发明人 NISHIMURA, ISAO;SUZUKI, MASAYOSHI;YONEZAWA, FUMIKO;ENDO, MASAYUKI
分类号 G03F7/023;G11B5/31;C08K5/28;G03F7/022;G03F7/032;G03F7/075;(IPC1-7):C08K5/28;C08L33/06;G03F7/039 主分类号 G03F7/023
代理机构 代理人
主权项
地址