发明名称 |
Radiation sensitive resin composition and use of the same in an interlaminar insulating film |
摘要 |
<p>A radiation sensitive resin composition which can be processed and molded at low temperatures and has resolution, solvent resistance, adhesion to a substrate and storage stability required as an interlaminar insulating film. This radiation sensitive resin composition comprises: (A) a copolymer obtained by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy compound such as beta -methylglycidyl acrylate and/or an epoxy compound such as a monomer represented by the following formula (3): <CHEM> and (a3) an olefinic unsaturated compound other than the above (a1) and (a2); and (B) a 1,2-quinonediazide compound.ti</p> |
申请公布号 |
EP1057859(A2) |
申请公布日期 |
2000.12.06 |
申请号 |
EP20000111681 |
申请日期 |
2000.05.31 |
申请人 |
JSR CORPORATION |
发明人 |
NISHIMURA, ISAO;SUZUKI, MASAYOSHI;YONEZAWA, FUMIKO;ENDO, MASAYUKI |
分类号 |
G03F7/023;G11B5/31;C08K5/28;G03F7/022;G03F7/032;G03F7/075;(IPC1-7):C08K5/28;C08L33/06;G03F7/039 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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