发明名称 Semiconductor processing techniques
摘要 <p>The present invention provides a manufacturing environment (110) for a wafer fab, and an SPC environment (112) for setting control limits and acquiring metrology data of production runs. A computation environment (114) processes the SPC data, which are then analyzed in an analysis environment (116). An MES environment (118) evaluates the analysis and automatically executes a process intervention if the process is outside the control limits. Additionally, the present invention provides for an electrical power management system, a spare parts inventory and scheduling system and a wafer fab efficiency system. These systems employ algorithms (735, 1135 and 1335). <IMAGE></p>
申请公布号 EP1058172(A2) 申请公布日期 2000.12.06
申请号 EP20000111306 申请日期 2000.05.25
申请人 APPLIED MATERIALS, INC. 发明人 NULMAN, JAIM
分类号 H01L21/66;G03F7/20;G05B19/4093;G05B19/418;G06Q50/00;H01L21/02;(IPC1-7):G05B19/418 主分类号 H01L21/66
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