发明名称 |
Acrylic monomer composition, acrylic copolymer, and heat resistant resin |
摘要 |
A heat resistant resin is formed by heating an acrylic monomer composition prepared by copolymerising an acrylic monomer represented by general formula (1) with another monomer that is copolymerisable with the acrylic monomer, the acrylic monomer composition having an acid value of 5mgKOH/g or less, <CHEM> where each of R<1> and R<2> is either a hydrogen atom or an organic residue. A 1% tetrahydrofuran solution formed by subjecting the acrylic copolymer to a heat treatment at a temperature of 250 DEG C for 30minutes and thereafter dissolving the acrylic copolymer in tetrahydrofuran has a viscosity ranging from 10cps to 10,000cps at 25 DEG C. The acrylic polymer does not gel in the manufacture of a heat resistant resin, and by using the acrylic polymer as a material for a heat resistant resin, the resultant heat resistant resin obtained boasts excellent transparency and mouldability, and can be moulded by melting. |
申请公布号 |
EP0987282(A3) |
申请公布日期 |
2000.12.06 |
申请号 |
EP19990118181 |
申请日期 |
1999.09.13 |
申请人 |
NIPPON SHOKUBAI CO., LTD. |
发明人 |
NAKAGAWA, KOUICHI;MORITA, TAKEHIKO |
分类号 |
C07C69/732;C07D309/30;C08F8/48;C08F20/04;C08F20/26;C08F20/28;C08L33/00 |
主分类号 |
C07C69/732 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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