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发明名称
INDIRECTLY-HEATED STRUCTURE OF POWER AMP MODULE
摘要
申请公布号
KR200205973(Y1)
申请公布日期
2000.12.01
申请号
KR19950036487U
申请日期
1995.11.29
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, BUM-KU
分类号
H04B7/26;(IPC1-7):H04B7/26
主分类号
H04B7/26
代理机构
代理人
主权项
地址
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