| 摘要 |
The invention relates to a method for manufacturing a contact chip card, characterized in that it comprises the following steps: a dielectric support film (60) is provided in the form of a strip: a metal grid (18) which defines contact pads (19a) on the upper surface thereof and connection pads (19b) on the lower surface thereof is created; the dielectric support film (60) is irremovably fixed on the upper surface of the metal grid (18) in such a way that the contact pads (19a) of the grid (18) are freed: the chip (19b) is glued and connected to the connection pads (19b) of the grid (18);: the metal grid is cut to obtain a micromodule (100) in the cavity (120) of a body of the card (110). In one particular embodiment, the grid is arched in order to encase the operation of the dielectric (60). |
