A METHOD OF FABRICATING MULTI-INTERCONNECTION LINE

摘要

PURPOSE: A method for manufacturing a multilayered interconnection is provided to prevent a short circuit of an upper interconnection formed on an interlayer dielectric, by improving topography of the interlayer dielectric covering an interconnection pattern and a dummy pattern. CONSTITUTION: A plurality of the first interconnections(27) are formed in a predetermined portion of a substrate(21) while a plurality of the first dummy patterns are formed in a predetermined portion between the first interconnections. The first dummy pattern is so formed that an interval between the first dummy pattern and the first interconnection is 1.5 times as wide as the width of the first interconnection. The first interlayer dielectric is formed to cover the plurality of the first interconnections and the plurality of first dummy patterns. The aforementioned processes are repeated by n-1 times(n is a natural number greater than 1). A plurality of the n-th interconnections are formed on the n-th interlayer dielectric.