发明名称 LEAD FRAME FOR WIRE-BONDING AND METHOD OF FORMING A SEMICONDUCTOR DEVICE BY USE OF THE LEAD FRAME
摘要 A lead frames has a forked top portion which has a recessed portion adjusted for receipt of a wire so that the wire is so caught by the forked top portion as to prevent the wire from being largely carried. Even if the density of the wires is high, the wires are not carried by the flow of the molten resin so that the wires are kept from contact with each other thereby avoiding short circuits. At the corners, the distance of the adjacent two wires is narrower than the other positions. Notwithstanding, the wires at the corners are also prevented by the forked top portion of the lead frame from being largely carried by the flow of the molten resin so that the wires are kept from contact with each other thereby avoiding short circuit.
申请公布号 KR100272718(B1) 申请公布日期 2000.12.01
申请号 KR19970052785 申请日期 1997.10.08
申请人 NEC CORPORATION 发明人 SHINGAI, TADAYUKI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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