Enhancement of cleaning of semiconductor treatment chamber involves coating chamber components with fluorinated polymer

摘要

Reactive gas is used to remove material accumulated on the chamber components by chemical etching. At least one component (12, 13) coated with fluorinated polymer is exposed to the reactive gas. Preferably, polymer-coated components are those of large dimensions and/or a number of smaller components. Preferably, all surfaces making contact with reactive gas are coated with fluorinated polymer. Distribution plate for distribution of gas as the gas flows in a treatment chamber comprises a base in which a number of holes are formed and a continuous coating of fluorinated polymer of thickness 0.5-10 microns formed on the material of the base. Independent claims are given for: (a) a support plate for distributing gas an it flows in the treatment chamber; (b) apparatus for the treatment of a substrate in a chamber and for cleaning the chamber components by removal of layers of accumulated material; and (c) processes for cleaning a treatment chamber by using a reactive agent.