发明名称 |
PHOTOSENSITIVE DIELECTRIC SHEET COMPOSITION AND MULTILAYER INTERCONNECT CIRCUITS |
摘要 |
A photosensitive dielectric sheet composition and the manufacture of multilayer interconnect circuits therefrom. The multilayer interconnect circuits embody circuitry as well as discrete components such as capacitors and resistors in a compact configuration. |
申请公布号 |
KR100268695(B1) |
申请公布日期 |
2000.12.01 |
申请号 |
KR19930019342 |
申请日期 |
1993.09.22 |
申请人 |
E.I.DU PONT DE NEMOURS AND COMPANY |
发明人 |
SUESS, TERRY R;NEBE, WILLIAN JOHN |
分类号 |
G03F7/004;G03F7/027;G03F7/032;G03F7/033;H01L23/14;H05K1/03;H05K1/09;H05K3/00;H05K3/46;(IPC1-7):G03C1/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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