| 摘要 |
PURPOSE: A method for detecting a popcorn defect of a semiconductor package is provided to obviate the necessity of an additional sample, by detecting pressure variance inside the semiconductor package before and after a soldering process so that a defect caused by a popcorn effect can be inspected. CONSTITUTION: The inside pressure of a semiconductor package after a soldering process is detected. The detected quantity of the pressure is compared with a predetermined value. If the detected quantity of the pressure is greater than the predetermined value, a defect caused by a popcorn effect of the semiconductor package is determined and displayed.
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