PHOTORESIST COATING METHOD OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for applying photoresist of a semiconductor device is provided to have no influence on the thickness of the photoresist coated on a wafer, by performing an edge bead removal(EBR) process after the photoresist is dried. CONSTITUTION: A wafer is loaded, and is placed on a spin chuck of a coating track to spray photoresist. The wafer is revolved for a predetermined interval of time to apply the sprayed photoresist on the wafer by a predetermined thickness. The wafer is revolved to dry the photoresist after the thickness of the photoresist is controlled. An edge bead removal(EBR) process is performed after the dry process is completed. After the wafer is revolved to dry an EBR solution, the wafer is unloaded.