PROCESS OF BACUUM LITHOGRAPHY AND THIN FILM AS RESIST

摘要

PURPOSE: A vacuum lithography process is provided to clean a substrate by a plasma treatment, to form and develop a resist layer by plasma polymerization and plasma etching respectively, and to form a pattern by an electron beam, in a single vacuum chamber. CONSTITUTION: A substrate is cleaned by using a plasma treatment. A resist layer is formed by using plasma polymerization. An electron beam is exposed. The resist layer is developed by using a plasma etching process. The resist layer is stripped. The aforementioned processes are performed in a single chamber.