发明名称 METHOD FOR TREATING SILICON WAFER
摘要 PROBLEM TO BE SOLVED: To avoid deterioration of working efficiency and working environment dnue to the mask for sandblast treatment by applying adhesive sheets with a specific pattern onto a silicon wafer and performing a sandblast treatment to the wafer with the adhesive sheets as a mask for machining into a prescribed pattern. SOLUTION: Adhesive sheets 5 with a prescribed pattern are applied onto a silicon wafer 1, that is fixed to a pedestal 3 by pressing the adhesive sheets 5 with a prescribed pattern that are provided at a mold release sheet 6 that is made of a plastic film or the like whose surface is coated with, for example, silicone and are supplied at a fixed speed onto the silicon wafer 1 for transferring using an application roller 7. The adhesive sheets 5 should have sufficient adhesion force for the silicon wafer 1, and various kinds of acryl and rubber adhesives are used.
申请公布号 JP2000331966(A) 申请公布日期 2000.11.30
申请号 JP19990142438 申请日期 1999.05.21
申请人 NITTO DENKO CORP 发明人 YAMAMOTO MASAYUKI;MIKI KAZUYUKI;NAMIKAWA AKIRA;AMETANI MINORU
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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