发明名称 |
SUBSTRATE WITH AT LEAST TWO METALLIZED POLYMER BUMPS FOR SOLDERED CONNECTION TO WIRING |
摘要 |
A substrate (S) with at least two metallized polymer bumps (PS), especially a polymer stud grid array, is configured in such a way that the polymer bumps (PS) have at least one step (ST) and at least one elevation (E). The geometry of the solder bumps (PS) ensures that the soldered connections to the wiring (V) are secure and guarantees reproducible layer thickness for the solder (L). |
申请公布号 |
WO0072378(A1) |
申请公布日期 |
2000.11.30 |
申请号 |
WO2000DE01497 |
申请日期 |
2000.05.11 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;VAN PUYMBROECK, JOZEF |
发明人 |
VAN PUYMBROECK, JOZEF |
分类号 |
H01L21/60;H01L23/13;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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