| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which an adhesive protection film can be separated easily from the surface of a device wafer, even when the device wafer is for smart cards. SOLUTION: In a method for stripping device wafer, a device wafer is stripped off an adhesive protection film, in such a way that the device wafer carrying the adhesive protection film stuck to its device pattern surface is held by a vacuum table chuck 2 which can make reciprocating motions in the lateral direction, in a state where the surface of the film 4 is sucked to the chuck 2 and a vacuum roll 3 which is rotatable about its axis of rotation is brought into contact with the surface of the wafer opposite to the film 4, while the chuck 2 is moved forward and rotated. Consequently, the device wafer is sucked to the surface of the roll 3 and stripped off the film 4 by leaving the film 4 on the chuck 2 following rotation of the roll 3. |
