发明名称 RAPID COOLING APPARATUS USING COOLING LIQUID
摘要 PROBLEM TO BE SOLVED: To contrive high temperature gas to be cooled rapidly by a method wherein the high temperature gas is allowed to pass in a short time along passages formed by liquid cooling pipes inside the liquid cooling pipes having superposition structure through which cooling liquid passes. SOLUTION: The rapid cooling apparatus comprises forming an opening part 3 for introducing high temperature gas on a lower part, assembling and superimposing successively at spaces in parallel each of plane liquid cooling pipes (a) in which a number of liquid cooling pipes 5 are allowed to be in line and disposed on the same plane at spaces inside a rapid cooling tube body 2 including an introducing and exhausting opening part 4 on an upper part for exhausting low temperature gas after heat exchange, and forming a gap between the adjoining liquid cooling pipes 5 structuring each of the plane liquid cooling pipes (a) as gas passages. Thereby the high temperature gas flowing through is allowed to have heat exchange via the liquid cooling pipes 5 by supplying cooling liquid from one opening end of the plane liquid cooling pipes (a) toward the other opening end of the same.
申请公布号 JP2000329330(A) 申请公布日期 2000.11.30
申请号 JP19990138841 申请日期 1999.05.19
申请人 TAMURA TETSUTO;OTSUKA KATSUMI 发明人 TAMURA TETSUTO
分类号 F23J15/06;F28D7/10 主分类号 F23J15/06
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