发明名称 GRASPING DEVICE FOR WIRE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a grasping device for wire material wherein the wire material is grasped or ejected without being affected by thickness of wire material. SOLUTION: A fixing tab 11 with stepwise structure on one surface which is provided with a slit 11a where one side of a discharge arm 13 for discharging a wire material 19 supplied from a nozzle 18 for winding moves; and a movable tab 12 which is, comprising one surface to contact the step-like surface, so provided as to cope with the fixing tab 11 for free rotation by driving from an air cylinder 16 with a supporting point pin 14 as a supporting point under excitation by a spring 15; are provided.
申请公布号 JP2000331860(A) 申请公布日期 2000.11.30
申请号 JP19990144475 申请日期 1999.05.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OZAKI HIROMASA;WADA HIROSHI
分类号 H01F41/06;B65H54/10 主分类号 H01F41/06
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