METHOD AND DEVICE FOR MOUNTING WAFER TO WAFER FRAME AND FACING DEVICE INCORPORATING MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To release protection tape from a wafer without damaging for mounting to a wafer frame for dicing by applying the reverse side of the wager to a wafer sheet which is applied to the wafer frame, and then releasing the protection tape from the wafer. SOLUTION: A semiconductor wafer W is positioned and placed at a prescribed position of a stage P. In this case, the semiconductor wafer W is placed with a side where a protection tape T is applied facing down. Then, a wafer frame F for dicing is positioned and placed at a prescribed position for the semiconductor wafer W. After that, a wafer sheet S is applied to the wafer frame F and the reverse side of the semiconductor wafer W for cutting a surplus outer-periphery part. Then, the wafer frame F where the wafer S is applied is inverted, thus positioning the surface side of the semiconductor wafer F where the protection tape T is done above. Then, the protection tape T is released from the surface of the semiconductor wafer W.