| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of electronic components by further reducing the thickness of the semiconductor substrate of the parts, and at the same time, to manufacture electronic components with which operate as an electronic circuit without troubles and has fastness where the parts can sufficiently operate, even when the components are used for portable electronic equipment. SOLUTION: A method for manufacturing electronic components includes a first applying step S12 of applying a sealing resin to the surface of a substrate on which posts are formed, a rear surface polishing step S18 of polishing the rear surface of the substrate, and a separating step S26 of dividing the substrate into individual electronic components by cutting the substrate into pieces together with the sealing resin. |
