发明名称 METHOD OF PRODUCING SURFACE MOUNTED SUBSTRATE AND SOLDERING PLATE USED THEREIN
摘要 PROBLEM TO BE SOLVED: To prevent failure of soldering in a mounting land at the end of a substrate by outwardly and excessively coating cream solder on a mounting land provided at the end of the substrate compared to the inner mounting lands. SOLUTION: Cream solder 6 is outwardly and excessively coated on part foot lands 5a and 5b provided at the end of a substrate compared to an inner part foot land 5. When the cream solder 6 is excessively coated, extrusion of the cream solder 6 is enlarged outside the part foot lands 5a and 5b at the end of the substrate in introducing into a reflowing furnace. In this state, when introducing into the reflowing furnace, the cream solder 6 begins melting and also cohering, but a large quantity of cream solder 6 is not drawn toward the inner part foot land 5 because a large quantity of cream solder 6 is present outside the part foot lands 5a and 5b at the end of the substrate. Consequently, solders 7 can be formed without insufficient solder on part foot lands 5, 5a and 5b.
申请公布号 JP2000332400(A) 申请公布日期 2000.11.30
申请号 JP19990145524 申请日期 1999.05.25
申请人 CANON INC 发明人 SATOMI KUNIO
分类号 B23K1/00;B23K3/06;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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