| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a highly accurate dam, an efficient production method therefor, and a production method of wiring board where contamination at the connection terminal and circuit conductor of a semiconductor chip is suppressed. SOLUTION: The wiring board for mounting a semiconductor chip has a UV-curing resin dam for sealing the part mounting the semiconductor chip. The production method of wiring board has a step for forming a phorosensitive insulation layer on the surface of a substrate formed with a circuit, and a step for forming a dam by exposing and developing the phorosensitive insulation layer through a photomask wherein a material containing no solvent is employed in the phorosensitive insulation layer.
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