| 摘要 |
PROBLEM TO BE SOLVED: To facilitate electrical and mechanical interlayer connection of a built-up multilayer interconnection board by providing a thickness-direction conductive film where a conductor penetrates an insulating film which is softened at press-fitting to a body, which is to be connected, under heat, and stacking a copper foil for a hot press-fitting molding before an outer-layer circuit pattern is formed at the copper foil. SOLUTION: First, a conductor terminal 2 of a thickness-direction conductive film 6 and a land 3 of a multilayer printed wiring board 7 where an innerlayer circuit pattern which is a terminal of a body, which is to be connected, is formed are aligned and stacked, and further a copper foil 4 for forming an outer-layer circuit is stacked. Through hot press-fitting, an insulation film 1 is fitted and softened/melted, while the conductor terminal 2 of the thickness- direction conductive film 6 penetrates the insulating film 1, resulting in the contact between conductors for electrical continuity. Furthermore, by making hot press-fitting the insulating film 1 to be thermally cured, while bonded to the object to be connected. Thereafter, an outer-layer circuit pattern 5 is formed for easy connection between layers. |
