发明名称 RESIN COMPOSITION FOR SOLDER RESIST AND ITS HARDENED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a compsn. having excellent sensitivity, resolution, heat resistance for soldering, chemical resistance, adhesion property and low water absorption and excellent dielectric characteristics such as a low dielectric const. and low dielectric tangent in a submicrowave band by incorporating each specified polymer or copolymer and polymerizable monomer mixture. SOLUTION: The compsn. contains a polymer or copolymer (A) having the structural unit expressed by formula I and a polymerizable monomer mixture (B) containing a polymerizable monomer expressed by formula II and a polymerizable monomer expressed by formula III as the essential components. In formulae, each of X1, X2, Y1, Y2, Z1 is a 3-8C branched alkyl or substd. branched alkyl group or 4-8C cycloalkyl or substd. cycloalkyl group, and n and m are 0 or 1. The weight average mol.wt. of the polymer or copolymer (A) is 5000 to 200000. The polymer or copolymer (A) has a random structure in the polymer chain.
申请公布号 JP2000330274(A) 申请公布日期 2000.11.30
申请号 JP19990136864 申请日期 1999.05.18
申请人 NOF CORP;TDK CORP 发明人 OKUO MASAMI;TAKAOKA TOSHIAKI;KATO YUKIHIRO;MIO SHIRO;AMAYA NAOYUKI;HASEGAWA HIROAKI;YAMADA TOSHIAKI;ASAMI SHIGERU
分类号 H05K3/28;C08F267/06;C08L35/02;G03F7/027;G03F7/033 主分类号 H05K3/28
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