| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor useful for manufacturing a most advanced semiconductor device while ensuring reliability, and a semiconductor device having enhanced reliability. SOLUTION: The resin composition for sealing a semiconductor device contains a filler A, i.e., spherical fused silica having maximum grain size of 45μm or less, wherein the particle size of metallic impurities contained in the resin composition has a grain size of 53μm or less. The semiconductor device is sealed with a resin composition containing a filler A, i.e., spherical fused silica having maximum grain size of 45μm or less, wherein the particle size of metallic impurities contained in the resin composition has grain size of 53μm or less.
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