| 摘要 |
PROBLEM TO BE SOLVED: To maintain state of grounding of a microwave oscillator IC, even under temperature variation and to obtain the stable oscillation frequency of the oscillator IC in a local osllation module. SOLUTION: Two upper and lower shielding cases 4 and 5 are secured to a printed board 2, which is mounted with a microwave oscillator IC1 and is connected with the oscillator IC1, holding the board 2 between them and the cases 4 and 5 obtain grounding with the board 2. The peripheral edge parts 1a of the oscillator IC1 are pressed by a plate spring 3 from the direction of the case 4 on the upper side of the oscillator IC1, to make the oscillator IC1 adhere closely to the board 2. The spring 3 has a plurality of leg parts, which press the peripheral edge parts 1a of the oscillator IC1 from the top panel part of the spring 3 and in the state extending from the top panel part in the direction of the lower part of the spring 3 and is covered on the oscillator IC1. A difference between the expansivities of a substrate under the oscillator IC1 and the board 2 due to a temperature variation is absorbed by the spring elasticity of the spring 3, and while the ground planes of both of the substrate and the board keep contact with each other, the positions relative to the substrate and the board can be changed continuously.
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