| 摘要 |
PROBLEM TO BE SOLVED: To enable increasing bonding property between terminals and electrodes of an object to be molded such as a semiconductor chip and a circuit board by using sheet resin in which filters are mixed. SOLUTION: This method is provided with a preliminary contact-bonding process, wherein a surface formed on a semiconductor chip 1 on which surface metal bumps 2 having acute tips are formed is penetrated with a sheet resin 3, lamination is performed, and preliminary contact-bonding is performed integrally by exposing the tips of the metal bumps 2 in a metal mold 10 for plastic molding, and a plastic molding process wherein the semiconductor chip 1 after preliminary contact-bonding is mounted on a circuit board 13 via the sheet resin 3 and heated and pressed, the metal bumps 2 and wiring electrodes 14 of the circuit board 13 are bonded, and a part between the semiconductor chip 1 and the circuit board 13 is sealed with resin. |
