发明名称 PRINTED-CIRCUIT BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To simplify manufacturing processes, and to eliminate time and economical losses by allowing at least one end face of a conductive material being filled into a through hole passing through a wiring pattern and an insulation sheet to project from the alignment surface between the insulation sheets and/or the wiring patterns. SOLUTION: A conductive metal sheet 14 made of metal that is alienated and has the same quality of a material as a conductive material is positioned at the upper part of an insulation sheet 11 where a wiring pattern 13 is formed. Furthermore, a punching die 15 with the same diameter as a through hole that should be opened is positioned on the conductive metal sheet 14; the conductive metal sheet 14, the wiring pattern 13, and the insulation sheet 11 are punched by the die 15 and a press machine; and the through hole 16 is opened in the wiring pattern 13 and the insulation sheet 11. Then, the conductive metal sheet 14 enters the through hole 16 for filling the through hole 16 with conductive substance 17 of one part of the conductive metal sheet. At the same time, a projection part 18 where the tip part of the conductive substance 17 projects from the lower wiring pattern 13 is formed, and a unit substrate 19 is composed.
申请公布号 JP2000332369(A) 申请公布日期 2000.11.30
申请号 JP19990144275 申请日期 1999.05.25
申请人 MITSUI MINING & SMELTING CO LTD 发明人 ISHII MASATO;ICHIYANAGI AKIRA;ARAI DAISUKE
分类号 H05K1/11;H01L21/48;H01L23/498;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/11
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