| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer protection tape which can prevent damages to a wafer, when the wafer is worked or transported, and, in addition, can be handles easily when the wafer is transferred. SOLUTION: A wafer protection tape T is stuck to one surface of a wafer W, when the other surface of the wafer W is worked with a planarizing device and is composed of a flexible first sheet B and a second sheet D having elastic strength. The recessed and projected sections (x) formed on the surface of the wafer W are absorbed by the flexible first sheet B and the warping of the wafer caused by the own-weight of the wafer W is held by means of the second sheet D.
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