| 摘要 |
The invention relates to a method for the production of a portable integrated circuit electronic device, whereby an integrated circuit chip (10) is transferred onto a dielectric support (60) and connected to a metal grid (18) comprising contact pads (19a) and connection pads (19b). The invention is characterized in that it comprises a step in which a housing (85) is created for the chip (10) on a metal grid (18) by arching (80) said grid. The dimensions of the housing (85) enable said housing to accommodate the thickness of the card (10) and the contact pads (11) thereof. The invention is also characterized in that the grid (18) is laminated on the dielectric support (60), whereby each contact pad (11) of the card (10) can be placed opposite to and in contact with said connection pads (19b) of the grid (18). |
