METHOD OF CONNECTING IC CHIP

摘要

PROBLEM TO BE SOLVED: To provide a connecting method making it possible to reduce deformation such as warpage and crack and improve the connect reliability by heating both a circuit board and an IC chip facing to each other to thereby minimize the elongation difference between the circuit board and the IC chip. SOLUTION: The connecting method is such that connection members of a thermosetting insulative adhesive having an initial fluidity by heat are disposed between connection electrodes of a circuit board and an IC chip, the opposed electrodes are heated and pressed to electrically mutually connect the electrodes and solidify between components wherein the circuit board and the IC chip are heated respectively at given temperatures to minimize the elongation difference between the circuit board and the IC chip.