发明名称 |
ELECTRONIC COMPONENT MOUNTING BODY AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component mounting body which can ensure satisfactory connection reliability while using conductive resin in connections between a component electrode and a substrate electrode, and a manufacturing method thereof. SOLUTION: A substrate electrode 14 formed in a circuit substrate 15 and a component electrode 12 formed in an electronic component 11 are connected by conductive resin 13a and at least a part of a surface opposite to a surface of the component electrode 12 facing the substrate electrode 14 and at least a part of the substrate electrode 14 are coated with conductive resin 13b. Thereby, the electronic component 11 is mounted on the circuit substrate 15.
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申请公布号 |
JP2000332373(A) |
申请公布日期 |
2000.11.30 |
申请号 |
JP19990140674 |
申请日期 |
1999.05.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MITANI TSUTOMU;TAKEZAWA HIROTERU;ITAGAKI MINEHIRO |
分类号 |
H05K3/32;H05K1/18;(IPC1-7):H05K1/18 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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