发明名称 ELECTRONIC COMPONENT MOUNTING BODY AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To obtain an electronic component mounting body which can ensure satisfactory connection reliability while using conductive resin in connections between a component electrode and a substrate electrode, and a manufacturing method thereof. SOLUTION: A substrate electrode 14 formed in a circuit substrate 15 and a component electrode 12 formed in an electronic component 11 are connected by conductive resin 13a and at least a part of a surface opposite to a surface of the component electrode 12 facing the substrate electrode 14 and at least a part of the substrate electrode 14 are coated with conductive resin 13b. Thereby, the electronic component 11 is mounted on the circuit substrate 15.
申请公布号 JP2000332373(A) 申请公布日期 2000.11.30
申请号 JP19990140674 申请日期 1999.05.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MITANI TSUTOMU;TAKEZAWA HIROTERU;ITAGAKI MINEHIRO
分类号 H05K3/32;H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K3/32
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