| 摘要 |
PROBLEM TO BE SOLVED: To provide a clamp ring for substrate in a substrate processing device in which no crack occurs in the substrate during clamping. SOLUTION: A clamp ring 15 for substrate is arranged in a substrate processing device such as a plasma etching device 1, and the inner circumferential surface of a circular center hole 1511 is formed of an inclined surface 1522, and then a cover 1512 for retaining a substrate is formed in a circular opening of a small diameter above the center hole 1511, and at least the inclined surface 1522 of the center hole 1511 is made of elastic material.
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