发明名称 CIRCUIT PROTECTION ELEMENT AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide an easily manufacturable circuit protection element having a satisfactory fusion characteristic. SOLUTION: This circuit protection element 10 is made up by providing electrodes 12 on both sides of a rectangular plate-shaped substrate, forming a fuse element 14 out of a metallic film so as to extend over to the electrodes 12, and covering the metallic film by a protection film 15. As the substrate, a mica (or mica-containing) ceramic substrate, an aluminum titanate substrate, or a wallastonite substrate 11 is used to reduce heat conduction from the metallic film.
申请公布号 JP2000331590(A) 申请公布日期 2000.11.30
申请号 JP19990248636 申请日期 1999.09.02
申请人 KOA CORP 发明人 YAMAOKA ETSUJI;KOJIMA HIROSHI;ICHIKAWA HIROSHI
分类号 H01H85/06;C22C9/00;H01H69/02;H01H85/00;H01H85/02;H01H85/046;H01H85/10;H01H85/17;H01H85/34;H01H85/38;(IPC1-7):H01H85/06 主分类号 H01H85/06
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