发明名称 SHEET FOR PRINTED WIRING BOARD, METHOD OF FORMING VIA, RESIN SHEET HAVING FILLED VIA, PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 <p>A sheet for forming a printed wiring board which comprises a resin sheet (18) having a through-hole in the thickness direction and a metallic chip (46) inserted into the through-hole, and a method of manufacturing this sheet. The resin sheet (18) and a conductive metallic sheet (44) are placed in this order on a die base (16) having a die hole (14), then a hole is formed in the conductive metal sheet (44) with a punch (10) from the conductive metal sheet (44) side. At the same time, a hole (20) is also formed in the resin sheet, the conductive metal chip (46) formed by the punching from the conductive metal sheet (44) is inserted into the through-hole formed in the resin sheet (18). Thus, the sheet is manufactured. The front and rear surfaces of the sheet can be electrically interconnected by inserting this conductive metal chip (46) into the through-hole, and many substrates are stacked and by protruding and inserting the conductive metal chip (46). Thereby, the sheets can be electrically connected in the thickness direction by this protruded conductive metal chip (46) and a multilayer laminated board can be easily manufactured.</p>
申请公布号 WO2000072644(P1) 申请公布日期 2000.11.30
申请号 JP2000002879 申请日期 2000.05.01
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