| 摘要 |
An integrated radiating enclosure (50) is disclosed. The enclosure is formed from a dielectric material with a radiating element formed on the exterior surface of the housing and a groundplane material (100) formed on the interior of the housing. The groundplane provides EMI shielding for the enclosed electronics. The three antenna elements are directly connected to the circuitry (60) of a transceiver system, thereby integrating the transceiver antenna components directly into the transceiver enclosure.
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