| 摘要 |
PROBLEM TO BE SOLVED: To stabilize a joint quality, at thermal joint between electrodes by providing a blow-out opening from which an inactive gas is jetted to the joint part near a component contacting the electronic component of a bonding tool, for preventing oxidizing at the joint part between a circuit board and an elec tronic component. SOLUTION: Related to a bonding took 2, with an electronic component 3 sucked/held under depressurizing action in an air path 11, a gas blow-out opening 2a at the lower end surface of the bonding tool 2 is positioned near, around the electronic component 3. An inert gas supplied through a gas flow path 2b is blown to a joint part 7 between the electronic component 3 and a circuit board 5 from the blow-out opening 2a. Since the inert gas is blown to the joint part 7 from near, around, the electronic component 3 which is relatively near the joint part 7, the concentration of inert gas does not decrease when reaching the joint part 7, so oxidation at the joint part 7 or solder material, etc., is prevented at thermal jointing.
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