| 摘要 |
PROBLEM TO BE SOLVED: To obtain a mounting structure of electronic components which improves the moisture resistance wherein conductive connection members are inserted between opposed electrodes of electronic components and conductors of a circuit board so as to electrically connect these electrodes and the conductors. SOLUTION: A conductive connection member 5 is composed of a conductive adhesive 7 and a moisture-resistive resin 6, the adhesive 7 is disposed to contact both an electrode 2 and a conductor 4, the adhesive 7 is covered with the resin 6, the resin of the conductive adhesive 7 contains e.g. a bisphenol F type epoxy resin with a bisphenyl type and multifunctional type additives as a main component and a curing agent composed of a mixture of an amine type with a phenol type, and the moisture-resistive resin 6 is composed of a different resin from the component resin of the conductive adhesive 7 and contains a phenol novolak as a main component and a phenol type resin as a curing agent.
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