| 摘要 |
PROBLEM TO BE SOLVED: To reduce variation in history of treated substrates (wafers). SOLUTION: In a method for treating substrates, wafers can be transferred between a plating process, a cleaning process, and an annealing process by means of a transfer machine 5 in a fully automated state, and the wafers can be stably and continuously subjected to plating, cleaning, and annealing treatments, because the plating chamber 1 of plating equipment, a cleaning chamber 2 of cleaning equipment, and an annealing chamber 3 of annealing equipment are arranged around a collecting chamber 4 in which the transfer machine 5 is set up. Consequently, the transfer time of the wafers can be shortened, and the waiting time in equipment is reduced. Therefore, the time required for the series of processes of plating, cleaning, and annealing processes is stabilized, and the variation in the history of the wafers can be reduced.
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