PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having low water absorptivity and high heat resistance. SOLUTION: This photosensitive resin composition comprises (1) a reaction product of an epoxyacrylate (a) obtained by reacting a bifunctional epoxy resin having a biphenyl skeleton with an acrylic acid; and a tetrabasic acid anhydride (b); and (2) an epoxy resin for blocking a carboxylic acid; and (3) a photopolymerization initiator thus permitting the obtained photosensitive resin composition to be high in sensitivity and good in developability and low in water absorptivity and superior in heat resistance.