发明名称 CONDUCTOR PASTE
摘要 PROBLEM TO BE SOLVED: To obtain high electric conductivity after baking without using flake or fine powder by containing metal powder and binder resin as an essential component, and a metal-containing organic compound insoluble to the binder resin component. SOLUTION: A metal-containing organic compound insoluble to binder resin is dispersed in paste, at least part of metal powder is covered with the metal- containing organic compound insoluble to the binder resin, and as the metal contained in the metal-containing organic compound, at least part of it is the same kind of metal as the metal powder contained in conductor paste, at least part of the metal-containing organic compound is an organic acid metal salt, at least part of the metal powder is silver powder, and as the binder resin, photosensitive resin is preferably contained. As the photosensitive resin, at least an alkali soluble polymer, a multifunctional monomer, and an optical initiator are preferably contained.
申请公布号 JP2000331535(A) 申请公布日期 2000.11.30
申请号 JP19990139545 申请日期 1999.05.20
申请人 TORAY IND INC 发明人 MATSUMURA NOBUO;KAMIOKA TAKENORI;OBAYASHI GENTARO
分类号 H05K1/09;G03F7/004;H01B1/22 主分类号 H05K1/09
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