| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package of reducing the amount of a radiation electromagnetic wave when mounting the semiconductor package to a printed-circuit board. SOLUTION: A semiconductor package 40 is provided with a semiconductor chip 44 that adheres to a die pad 42 and a lead 50 for external connection connected by an electrode 46 for the semiconductor chip and a bonding wire 48. They are sealed by a resin-sealing body 53 in a package. In the semiconductor package, a package surface 54 at the electrode side of the semiconductor chip opposes a printed-circuit board 56. Connection structure 58 consisting of the electrode of the semiconductor chip by wire and the connection part of a lead for external connection is arranged in the resin-sealing body at the surface side of the package. The lead projects from the resin-sealing body in parallel with the package surface, is bent in a direction that orthogonally crosses the package surface, and is bent outward in parallel with the package surface again so that it is joined to the wiring pattern 60 being provided on the surface of the printed-circuit board by soldering.</p> |
